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qualità Waterproof COB Fine Pixel Pitch LED Displays 600 Nits Brightness High Contrast Ratio fabbrica
qualità Waterproof COB Fine Pixel Pitch LED Displays 600 Nits Brightness High Contrast Ratio fabbrica
qualità Waterproof COB Fine Pixel Pitch LED Displays 600 Nits Brightness High Contrast Ratio fabbrica
qualità Waterproof COB Fine Pixel Pitch LED Displays 600 Nits Brightness High Contrast Ratio fabbrica
qualità Waterproof COB Fine Pixel Pitch LED Displays 600 Nits Brightness High Contrast Ratio fabbrica
qualità Waterproof COB Fine Pixel Pitch LED Displays 600 Nits Brightness High Contrast Ratio fabbrica
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Waterproof COB Fine Pixel Pitch LED Displays 600 Nits Brightness High Contrast Ratio

Marchio: No brand
Numero di modello: Display LED COB a pixel fini
Luogo di origine: Cina
Certificazione: CE, CCC, FCC, EMC, CB, RoHs
Quantità di ordine minimo: 1 pz
Prezzo: To be discussed
Capacità di approvvigionamento: 10000 sopra

Dettagli del prodotto


Frequenza di aggiornamento: ≥3840 Hz Rapporto di contrasto: 5000:1
Luminosità: 600 pidocchi Intervallo di umidità: 10% - 90% senza condensazione
Dimensioni del modulo: 300 mm*168,75 mm*22,5 mm Profondità di colore: 16 bit
Passo pixel: 0,9 mm/1,2 mm/1,5 mm/1,8 mm Angolo di visione: 170° orizzontale / 160° verticale
Tipo di installazione: Interno/esterno Temperatura operativa: Da -20°C a 60°C
Tutta la vita: 100.000 ore
Evidenziare

Fine Pixel Pitch LED Displays 600 Nits

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COB Fine Pixel Pitch LED Displays

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Waterproof COB LED Display

Descrizione di prodotto

Fine Pixel COB LED Display Screen LED Packaging Technologies Front-mounted Chip Technology Front electrode blocks light, resulting in lower light emission efficiency Insulating adhesive used for die bonding leads to reduced heat dissipation Requires gold wire electrical connections, resulting in lower reliability Lower operating current and power capabilities Flip Chip Technology Bottom-mounted electrodes don't block light, providing higher emission efficiency Metal

Product Highlights

Fine Pixel COB LED Display Screen LED Packaging Technologies Front-mounted Chip Technology Front electrode blocks light, resulting in lower light emission efficiency Insulating adhesive used for die bonding leads to reduced heat dissipation Requires gold wire electrical connections, resulting in ...

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