Micro Type COB LED Display Flip Chip Common Cathode Ultra Fine Display
Product Details
| Product Name: | Micro-type Fully Flip-chip Common Cathode COB Display Panel | PCB (Printed Circuit Board) Material: | This Is The Core Component That Carries All The Parts. It Is Typically A High-performance Multilayer Board Of FR-4 Grade, Offering Excellent Electrical Performance And Heat Dissipation. |
|---|---|---|---|
| Application: | Home Theaters, High-end Conference Rooms, Control Rooms, Studios, Exhibitions, High-end Commercial Displays, Virtual Filming, Etc. | Feature: | Seamless Splicing – No Visible Gaps, Creating A Truly Unified Display Surface. • Excellent Heat Dissipation – Efficient Thermal Management For Stable Performance. • Superior Flatness – Ensures Consistent Image Quality Across The Entire Screen. • Low Temper |
| Function: | Employing Full Flip-chip COB Common Cathode Technology, It Achieves Pixel-level Precise Light Control, Delivering Pure Blacks And Ultra-high Contrast For A Stunningly Immersive Visual Experience. The Surface Light Source Design Ensures A Uniform And Soft I | Dimensions: | 150×168.75mm |
| Weight: | Cabinet Weight: 4.7 Kg (per Cabinet) Module Weight: 1.2 Kg (per Module) | Color: | White And Black Colors Are Customizable |
| Shape: | Standard Rectangle | Service: | 2-3 Years Warranty + Free Spare Parts + Lifetime Remote Support + RMA Repair + On-site Service Available |
| Pattern: | 1R1G1B SMD | Control System: | NovaStar / Linsn / Colorlight Synchronous Control System (Sending Card + Receiving Card) |
| Encapsulation Materials: | This Is The Core Of COB Technology. LED Chips Are Directly Encapsulated On The PCB, And The Surface Is Typically Covered With Highly Transparent, Aging-resistant Materials Such As Epoxy Resin Or Silicone To Provide Protection And Optimize Light Output. Som | Bottom Case: | Used To Secure And Protect Modules. Common Materials Are Die-cast Aluminum Or Injection-molded Plastic. Die-cast Aluminum Is Often Used In High-end Products Due To Its High Strength And Good Heat Dissipation. |
| Mask: | It Covers The Very Front Of The Module, Serving To Protect And Align The Optics. Traditionally, It's Made Of PC (polycarbonate) And Fiber. However, To Achieve Better Display Results, Many High-end COB Products Have Adopted A Maskless Design, With The Surfa | ||
| Highlight |
Micro Type COB LED Display,COB LED Display Cathode Ultra,COB Ultra Fine Display |
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Product Description
Micro-type fully flip-chip common cathode COB display panel
Main features:
- Flip Chip Technology COB flip chip technology means that the electrodes of the flip chip face downwards, and it does not require the wire bonding process of the upright chip. This makes the active layer closer to the substrate, shortens the heat flow path from the heat source to the substrate, has lower thermal resistance, and can greatly improve product stability.
- "Common cathode" refers to using a common cathode method to power LED displays. For products of the same specifications and brightness, common cathode LED displays consume approximately 40% less power than conventional LED displays, resulting in reduced energy consumption.
- Matte Finish
This product combines a nano-superconducting epoxy resin coating on the screen to ensure consistent ink color over a long period, achieving ultra-high contrast without affecting brightness. The surface uses a matte, non-reflective treatment technology to prevent glare and protect the eyes, bringing a comfortable visual experience. - High Protection: Compared to SMD LED screens, COB technology offers a higher level of protection. It provides advantages such as waterproofing, impact resistance, moisture resistance, shock resistance, oxidation resistance, salt spray resistance, anti-static properties, and easy cleaning, significantly reducing issues like dead LEDs and poor contact caused by collisions during transportation, installation, and use.
- Low failure rate: The COB process encapsulates the light-emitting chip on a PCB board, and the heat of the chip is quickly transferred out through the copper foil on the PCB board. It also eliminates the need for high-temperature processes such as reflow soldering, which greatly reduces the damage to the light-emitting chip. In addition, the yield rate of the COB process is constantly improving, so the failure rate is greatly reduced.
- The image is softer. COB realizes the conversion from "point" light source to "area" light source, which has better light perception. The area light source emits light without pixelation, making the image softer. It effectively suppresses moiré patterns, resulting in a higher quality display. It is not harmful to the eyes when viewed at close range and is less likely to cause visual fatigue.
Product Advantages:
• Seamless splicing – no visible gaps, creating a truly unified display surface.
• Excellent heat dissipation – efficient thermal management for stable performance.
• Superior flatness – ensures consistent image quality across the entire screen.
• Low temperature rise – keeps the panel cool even during extended operation.
• Long lifespan – built with durable components for years of reliable service.
• Fanless design – eliminates moving parts, reducing maintenance needs.
• Silent operation – zero noise, perfect for quiet environments like home theaters and conference rooms.
• Automatic alarm system – real‑time monitoring with instant fault alerts.
• Low failure rate – high reliability with minimal downtime.
• Safe and secure – designed with multiple protections for worry‑free use
Product Specifications
| Parameter | P0.78125 | P0.9375 | P1.25 | P1.5625 |
|---|---|---|---|---|
| Pixel Pitch (mm) | 0.78125 | 0.9375 | 1.25 | 1.5625 |
| Pixel Density (px/m²) | 1,638,400 | 1,137,778 | 640,000 | 409,600 |
| Cabinet Resolution (px) | 768 × 432 | 640 × 360 | 480 × 270 | 384 × 216 |
| Refresh Rate (Hz) | ≤ 3840 | |||
| Cabinet Size (mm) | 600 × 337.5 × 28 | |||
| LED Type | Flip‑chip Common‑Cathode COB Package | |||
| White Balance Brightness (CD/m²) | 200 ~ 1000 (adjustable) | |||
| Contrast Ratio | ≥ 1,000,000 : 1 | |||
| Gray Scale (Bit) | 13 ~ 16 |
Strict Aging Test Procedure
Before shipment, every display unit undergoes a rigorous aging test (burn‑in test) . During this process, the screen operates continuously under full‑load conditions for an extended period, simulating real‑world usage scenarios. This critical step ensures long‑term stability, identifies any potential component issues early, and guarantees that your display delivers reliable, flicker‑free performance from day one.
Pre‑Shipment Precision Calibration
Prior to packaging, our experienced engineers perform a comprehensive pre‑shipment calibration on each cabinet. Using advanced optical instruments, we fine‑tune brightness, color uniformity, and grayscale accuracy pixel by pixel. This meticulous process ensures that every unit achieves optimal visual consistency, so your screen arrives ready to deliver stunning, perfectly matched imagery – right out of the box.
Your Assurance of Quality
With our aging and calibration protocols, you can be confident that your display will perform flawlessly upon installation, providing the exceptional visual experience you expect.

FAQ: What are the differences between COB, GOB and SMD LED modules?
Comparison Table
| Aspect | SMD (Surface‑Mounted Device) | GOB (Glue‑on‑Board) | COB (Chip‑on‑Board) |
|---|---|---|---|
| Technology Principle | Individual LED chips are soldered onto the PCB surface via SMT process. | Based on SMD, a transparent protective adhesive layer is vacuum‑molded over the PCB and LED chips. | LED chips are directly bonded (die‑attached) onto the PCB substrate and encapsulated as a whole, eliminating the individual package step. |
| Light Source Type | Point light source | Point light source (optimized by the protective layer) | Surface light source |
| Pixel Density | Low to medium; difficult to achieve below P1.0 | Limited by SMD structure; hard to realize ultra‑fine pitch | Extremely high; supports pixel pitches below P0.5 |
| Protection Performance | Weak; exposed chips are vulnerable to moisture and physical impact | Strong – provides waterproof, dustproof, anti‑static, anti‑collision and other “ten‑fold” protective features | Strongest – integrated encapsulation offers excellent resistance to impact, moisture, dust and static electricity |
| Display Quality | Visible pixel grain at close viewing distances; physical gaps between chips | Good uniformity; 160° wide viewing angle; effectively reduces moiré patterns | Best – seamless splicing, fine image without graininess, near‑180° viewing angle, precise color rendition |
| Heat Dissipation | Average | Relatively poor (the adhesive layer may hinder heat dissipation) | Excellent – chips directly contact the PCB, low thermal resistance and fast heat conduction |
| Maintenance | Easy – individual LEDs can be replaced on‑site | Moderately easy – protective layer reduces damage rate; field repair possible | Difficult – a faulty module usually requires full replacement; high repair cost |
| Cost | Low (mature technology) | Medium (between SMD and COB) | High (complex process and high equipment investment) |
| Typical Applications | Outdoor advertising, stage backdrops, stadiums, and other medium‑to‑large pitch scenarios | Public transport, education, retail, and other environments requiring enhanced protection | High‑end conference rooms, command & control centers, home theaters, showrooms – any ultra‑fine‑pitch, premium setting |
Summary: Which one should you choose?
| If you need... | Recommended |
|---|---|
| Ultimate image quality + ultra‑fine pitch, and budget is not a primary concern | COB |
| High protection with a good balance of performance and cost | GOB |
| Cost‑effectiveness, larger pitch, and easy on‑site maintenance | SMD |
💡 Bottom line: SMD is the mature, economical entry‑level choice. GOB is an upgrade that adds robust protection on top of SMD. COB is the premium solution that delivers the best visual performance for high‑end installations. They are not absolute substitutes – they serve different market needs.
Ideal Applications – Quick View
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Exhibitions & Trade Shows – Fast rigging, brilliant visuals under bright lights
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Live-Streaming Studios – Flicker‑free, true‑colour performance for cameras
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Immersive Experiences & VR – Seamless, ultra‑smooth panoramic displays
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Product Launches & Events – Lightweight, quick setup, maximum stage impact
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Command & Control Centres – 24/7 reliability with front‑access maintenance
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Broadcasting Studios – Zero‑gap backdrops for virtual sets
Factory Tour / Manufacturing Capabilities
Process flow diagram

Production equipment
Automatic printing machine Features: Automatic detection of printing

Samsung SMT machine Features: High efficiency and precision

Automatic SMT machine Features: High efficiency and precision

Automatic packing machine Features: high efficiency and speed

Our Team Philosophy
"Specialization breeds excellence."
We believe that a focused, knowledgeable team is the cornerstone of great products and lasting client relationships. That's why we invest in continuous training, encourage innovation, and foster a culture of accountability and pride in our work.





Product Highlights
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