Micro Type Fully Flip Chip COB LED Display Panel Common Cathode LED Display
Rincian produk
| Nama Produk: | Panel layar COB katoda umum tipe mikro sepenuhnya flip-chip | Bahan PCB (Papan Sirkuit Cetak).: | Ini adalah komponen inti yang membawa semua bagian. Ini biasanya merupakan papan multilapis berkiner |
|---|---|---|---|
| Aplikasi: | Teater rumah, ruang konferensi kelas atas, ruang kontrol, studio, pameran, tampilan komersial kelas | Fitur: | Penyambungan yang mulus – tidak ada celah yang terlihat, menciptakan permukaan tampilan yang benar-b |
| Fungsi: | Dengan menggunakan teknologi katoda umum COB flip-chip, ia mencapai kontrol cahaya presisi tingkat p | Ukuran: | 150×168.75mm |
| Berat: | Berat Kabinet: 4,7 kg (per kabinet) Berat Modul: 1,2 kg (per modul) | Warna: | Warna putih dan hitam dapat disesuaikan |
| Membentuk: | Persegi Panjang Standar | Melayani: | Garansi 2-3 Tahun + Suku Cadang Gratis + Dukungan Jarak Jauh Seumur Hidup + Perbaikan RMA + Layanan |
| Pola: | SMD 1R1G1B | Sistem Pengendalian: | Sistem Kontrol Sinkron NovaStar / Linsn / Colorlight (Kartu Pengirim + Kartu Penerima) |
| Bahan enkapsulasi: | Inilah inti dari teknologi COB. Chip LED langsung dikemas pada PCB, dan permukaannya biasanya dilapi | Kasus bawah: | Digunakan untuk mengamankan dan melindungi modul. Bahan yang umum adalah aluminium die-cast atau pla |
| Masker: | Ini menutupi bagian paling depan modul, berfungsi untuk melindungi dan menyelaraskan optik. Secara t | ||
| Menyoroti |
COB LED Display Panel,Micro Type COB LED Display,COB Common Cathode LED Display |
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Deskripsi Produk
Product Highlights
Micro-type fully flip-chip common cathode COB display panel Main features: Revolutionary Flip-Chip COB Technology Engineered with state‑of‑the‑art flip‑chip COB (Chip‑on‑Board) technology and common‑cathode energy‑saving Micro LED chips, our display delivers an extraordinary 100W:1 ultra‑high ...
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Micro-type fully flip-chip common cathode COB display panel Main features: Flip Chip Technology COB flip chip technology means that the electrodes of the flip chip face downwards, and it does not require the wire bonding process of the upright chip. This makes the active layer closer to the ...
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