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kualitas P1.25 P1.56 Small Pitch COB Thin Flexible LED Screen Module pabrik
kualitas P1.25 P1.56 Small Pitch COB Thin Flexible LED Screen Module pabrik
kualitas P1.25 P1.56 Small Pitch COB Thin Flexible LED Screen Module pabrik
kualitas P1.25 P1.56 Small Pitch COB Thin Flexible LED Screen Module pabrik
kualitas P1.25 P1.56 Small Pitch COB Thin Flexible LED Screen Module pabrik
>

P1.25 P1.56 Small Pitch COB Thin Flexible LED Screen Module

Nama merek: No Brand
Nomor Model: Modul LED Fleksibel Dalam Ruangan P4 XR-B dengan 256×128mm
Tempat Asal: Cina
Sertifikasi: CE, CCC, FCC, EMC, RoHs
Jumlah pesanan minimum: 1 buah
Harga: To be discussed
Kemampuan Penyediaan: 10.000 ke atas

Rincian produk


Konsumsi daya: Rata-rata 150W/m² Tipe tampilan: dipimpin
Menyenangkan: 3840Hz Kedalaman warna: 16-bit atau lebih tinggi
Suhu pengoperasian: -20°C hingga 40°C nada piksel: Dapat disesuaikan
Kecerahan: Dapat disesuaikan, biasanya 800-850 nits Tipe instalasi: Instalasi Otomatis Mekanis
Nama Produk: Tampilan LED Mekanis Cerdas Dalam Ruangan Penggunaan: Dalam
Intelijen: Otomatisasi Mekanis KontrastRatio: ≥5000:1
Sudut Pandang: ≥140° Horisontal / ≥120° Vertikal Sistem kendali: Kontrol Cerdas dengan Manajemen Jarak Jauh
Kisaran kelembaban pengoperasian (RH): 20%—75%RH
Menyoroti

Small Pitch Thin Flexible LED Screen

,

COB Flexible LED Screen Module

,

P1.56 Thin Flexible LED Screen

Deskripsi Produk

P1.25 P1.56 New small-pitch COB flexible LED display module 1. Product Overview This product is an indoor COB (Chip‑On‑Board) flexible LED display, utilising full flip‑chip COB integrated packaging technology combined with a flexible PCB substrate. It achieves an optimal balance between ultra‑fine pixel pitch display and curved form‑factor capability. The display supports creative shape customisation, including inner arcs, outer arcs, cylindrical surfaces, and other irregular

Product Highlights

P1.25 P1.56 New small-pitch COB flexible LED display module 1. Product Overview This product is an indoor COB (Chip‑On‑Board) flexible LED display, utilising full flip‑chip COB integrated packaging technology combined with a flexible PCB substrate. It achieves an optimal balance between ultra‑fine ...

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