Assembly Process for LED Display Modules

Baking:
Lamp tube baking temperature: 75±5℃; PCB baking temperature: 105±5℃.

Solder Paste Printing:
Take the solder paste out of the refrigerator and let it warm up to the ambient usage temperature (25±3℃). After 4 hours of warming up, stir it clockwise with a mixer for 5 minutes.
➢ Auxiliary materials to prepare: stencil, solder paste, cleaning agent.

Automatic Pick-and-Place:
Automatic pick-and-place refers to using a high-speed pick-and-place machine to mount electronic components (LED lamps, ICs) onto the PCB.

Reflow Soldering:
Reflow soldering mainly involves melting the solder paste to fix the components onto the PCB.
➢ Test whether the oven temperature matches the set temperature, and adjust the temperature according to the corresponding LED lamp model of the product.
➢ The robotic arm places the PCB loaded with fixtures onto the track chain for reflow soldering.

Testing:
For boards that have undergone post-soldering, connect the power cord, ribbon cable, HUB board, and receiving card, and they can be lit up. Testing is mandatory here to confirm whether the lamp board is good or defective.

Assembly Processing and Aging Procedures:
For lamp boards that pass the test, a series of assembly processes will be carried out according to requirements.
➢ These include installing kits/casings, spraying conformal coating, potting (glue filling), and aging, among other procedures.